Laser Dicing Silicon Wafer

Dicing of silicon wafers may also be performed by a laser based technique the so called stealth dicing process.

Laser dicing silicon wafer.

Patterned and non patterned wafer substrates. The chapter provides an overview about the laser dicing process of electronics substrates with the focus on silicon. Demonstration of cutting features into 1 5 mm thick silicon wafers using a laser micromachining system equipped with a qcw laser. It works as a two stage process in which defect regions are firstly introduced into the wafer by scanning the beam along intended cutting lines and secondly an underlying carrier membrane is expanded to induce fracture.

Cut features are round holes with no cracking or rough edges. The microdice laser micromachining system leverages tls dicing thermal laser separation a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials such as silicon si silicon carbide sic germanium ge and gallium arsenide gaas into dies with outstanding edge quality while increasing manufacturing yield and throughput. However laser ablation has its own problems. For silicon wafers less than 100 μm thick laser ablation offers an alternative to the blade technique which is too powerful for the delicate thin wafers.

Blade dicing laser dicing and stealth dicing available on bare silicon patterned soi wafers and other non silicon materials. The minimum die dimension that the proposed method can achieve is 3 mm by 3 mm which in most cases meets the fabrication requirement of microfluidic chips. Vaporizing the wafer with a laser along the dicing path creates molten debris and microcracks. Laserod is a pioneer in maskless fast prototyping of laser patterns on a broad variety of substrates.

We specialize in processing very thin substrates with. Dicing services are available for all wafer diameters ranging from 50mm to 300mm. Compared to dicing with a rotary saw or laser ablation the proposed method lowers equipment cost from more than 50 000 to 1 000 for silicon wafer dicing. The same system can be used to downsize larger silicon wafers for use in smaller format processing tools.

How is laser dicing silicon being processed. Compared to industrial processes mechanical or already laser based dicing with ultra fast lasers promises material removal without damaging or weakening the surrounding material around the cut. Svm wafer dicing capabilities.