39 have combined laser pre drilling and single lip deep hole drilling process for hole producing in non planar.
Laser hole drilling parameters.
Ghoreishi et al 9 analyzed optimization of effective fac tors in geometrical specifications of laser percussion.
The diameter of these holes can be as small as 0 002 50 μm.
Laser drilling is the process of creating thru holes referred to as popped holes or percussion drilled holes by repeatedly pulsing focused laser energy on a material.
This is done by a uv laser with special beam delivery optics.
Such parameters as high accuracy drilling processing speed flexible hole shaping make laser micromachining technology the best choice for fuel injector nozzles production.
Laser micro drilling describes the use of a laser to drill precise orifices in various materials.
In the case of drilling polymer materials especially polymer based medical devices where hole precision accuracy and quality are critical attributes the choice of machining technique is as important as the laser wavelength selection.
Multiple hole drilling through thick kapton with good round shape holes 250 um and 125 um diameters multiple hole drilling through thick kapton with good round shape holes 25 um diameter hole.
Hole quality can be judged by.
If larger holes are required the laser is moved around the circumference of the popped hole until the desired diameter is created.
Multiple holes drilled in thick kapton with good result.
Internal form and taper and related geometrical features and the extent of heat affected materials.
Naeem et al 8 developed laser percussion drill ing of aerospace materials using high peck power fiber de livered 1 amp pumped pulsed nd yag laser.
The effect of different process parameters in the optimization of the process is investigated.
The optimum performance in laser drilling depends very much upon the proper selection of laser parameters as well as the physical properties of the workpiece material.
In the present research nd yag laser micro drilling of gamma titanium aluminide a new material which has performed well in laboratory tests as well as in different fields of engineering is studied.
As a result evaporation of the material proceeds without the interim melting phase and any further corrections such as burrs and bulges elimination are not necessary.
Laser drilling of sapphire using femtosecond laser radiation is a unique processing technique enabling no cracks in hole peripheries accurate taper control and smooth wall finish.
With an adaption of the laser parameters it is possible to produce bore holes.
Laser hole drilling in thick kapton.
Cromachining parameters for optimization of shallow hole drilling.
